It starts with wafer challenges ...
-
Wafer pre-alignment
-
Wafer identification
-
Wafer fine alignment
-
Wafer inspection
-
Bond pad inspection
-
Probe tip inspection
...continues with die quality
-
Dicing saw guidance
-
Die bonding
...and ends with mounting and traceability
-
Wire boding
-
Solder paste inspection
-
BGA alignment
-
BGA inspection
-
SMD placement
-
Package inspection
-
Package identification
-
Mark inspection